ENBIK RugCon-RV2-T1 , rugged compact edge computer , equipped with Intel® 14th/13th/12th Core™ i7/i5/i3 low power processor and support 3x 2.5GbE/2x PoE+, 6x COM/6x USB/8x IDIO, 5G/4G/LTE/WIFI/BT, IO screw-lock, Ignition Control
- 3x LAN, 2x POE+(option)
- 4x RS232/422/485, 2x RS232
- 6x USB ( Support 3x USB3)
- 1x Mic In/Line Out
- 4 Channel isolated DI, 4 Channel isolated DO
- 2x Displays (1x DVI-D, 1x DP)
- 2x M.2 2280 M key (SATA III SSD) , support Raid 0/1
- 1x M.2 2242/3052 B key with SIM slot, support 4G/5G
- 1x Full Size Mini-PCIe with SIM slot, support 4G/5G
- 3x M.2 Key E Type 2230 for WIFI/BT/GPS
- Optional support 1x M.2 2280 Key M ( PCIe x4 ), Support AI acceleration card/image capture card/NVME SSD, etc.
- 6~48V Wide DC In Voltage Input,
- Support 1x DC Out 12V/1A Power output,
- Ignition Power Control
Only 21.1 cm wide,ENBIK RugCon-RV2-T1 combines a strong shell, low-power with high-performance computing ability and precise I/O design under small size, which is especially suitable for machine vision, AGV/AMR , in-vehicle computers, robot control and automation control, and various different spaces with limited , in application places with limited power supply and various harsh and extreme edge environments.The system also has screw-lock mechanisms on the I/Os like Gigabit Ethernet, USB to guarantee rugged connectivity in shock/ vibration situation.
RugCon RV2-T1 is a low-power and economical AI-accelerated edge computing system with Intel® Core low-power high-performance processor. Equipped with 3 of 2.5 GbE( 2x PoE+), 4 RS232/422/485, 2 RS232, 6 USB, 8 Isolated DIO, 5 M.2 communication expansion slot and other rich and necessary interfaces. Through the M.2 2280 PCIE x4 expansion slot, it can be used to install the AI acceleration card to make RV2-T1 accelerate edge AI computing.
RV2-T1 supports MXM expansion interface, it can flexibly integrate the EBNIK MF1A MXM AI computing box to improve AI edge deep learning and inference ability. While driving high-performance computing with low-power configuration, it helps to reduce power consumption, with high computing power, high stability and high reliability, help customers realize deployment-intensive AI inference applications and maintain high cost-effectiveness.

| IO Interface | ||
| USB |
6 |
3x USB 3.2 Gen2x1(10Gbps)/USB 2.0,
3x USB 2.0 |
| Display |
2 |
1x DVI-D (1920 x 1200) , 1x DP(4096x 2304) |
| Audio |
1 |
1x Mic-In , 1x Line Out |
| LAN |
5 |
1x 2.5 GbE with TSN support (i226),
2x 2.5 GbE(i226), 2x Optional PoE+ |
| COM |
6 |
1x Isolated RS232/422/485, 3x RS232/422/285, 2x RS232 |
| CAN |
0 |
N/A |
| DIO |
8 |
4 Channel isolated DI, 4 Channel isolated DO |
| Storage | ||
| M.2 |
2 |
2x M.2 2280 SATA, support Raid 0/1 |
| 2.5” |
0 |
N/A |
| On Board Expansion | ||
| Mini-PCIe
M.2 Expansion |
5 |
1x Full Size Mini-PCIe with SIM supporting 4G/5G/LTE
1x M.2 2242/3052 B key with SIM supporting 5G/LTE 3x M.2 Key E Type 2230 for BT/GPS |
| M.2 2280 M key |
1 |
Optional support 1x M.2 2280 Key M ( PCIe x4 ), Support AI acceleration card/image capture card/NVME SSD, etc. |
| Mechanical | ||
| Mechanical | Dimension : 211(W) x 176(D) x 78(H) mm
Weight : 2.35 kg Mounting : Wall Mount |
|
| Mechanical | ||
| AI BOX | Support installing MF1A, this is ENBIK AI BOX which equipped with MXM GPU AI Card | |
| Environmental | ||
| Operating Temp. | -25°C ~ 70°C
-40°C ~ 85°C ( Extended) |
|
| Storage Temp. | -40°C ~ 85°C | |
| Humidity | 0%~90% , non-condensing | |
| Vibration | EN 50155:2017/ IEC 61373, Category I, Class B – Body mounted
MIL-STD-810H, Method 514.8, Category 4 |
|
| Shock | EN 50155:2017/ IEC 61373, Category I, Class B – Body mounted
MIL-STD-810H, Method 516.8, Procedure I |
|
| EMC | E-Mark, EN 50121 (EN 50155 EMC)
CE/FCC Class A, according to EN 55032 & EN 55035 |
|
| Power |
| 1x Power Button
1x 3-pin pluggable terminal block for 6~48V DC Input , 1x 4-pin pluggable terminal block forIgnition control and Remote Control 1x 2-pin pluggable terminal block for12V/1A DC output |
| Warranty |
| 3 Year Warranty |
| Intel® 14th (15W) | Intel® 13th (15W) | Intel® 12th (15W) | ||||||||||||
| CPU | Ultra 7‑155U | Ultra 7‑125U | i7‑1365URE | i7‑1365UE | i5‑1335UE | i3‑1315UE | i7‑1365U | i7‑1355U | i5‑1335U | i3‑1315U | i7‑1265U | i7‑1255U | i5‑1235U | i3‑1215U |
| DDR | DDR5 (Max. 96 GB) | DDR5 (Max. 64 GB) | ||||||||||||
| Cores / Threads | 12 C / 14 T | 12 C / 14 T | 10 C / 12 T | 10 C / 12 T | 10 C / 12 T | 6 C / 8 T | 10 C / 12 T | 10 C / 12 T | 10 C / 12 T | 6 C / 8 T | 10 C / 12 T | 10 C / 12 T | 10 C / 12 T | 6 C / 8 T |
| P Turbo | up to 4.8 GHz | up to 4.3 GHz | up to 4.9 GHz | up to 4.9 GHz | up to 4.5 GHz | up to 4.5 GHz | up to 5.2 GHz | up to 5.0 GHz | up to 4.6 GHz | up to 4.5 GHz | up to 4.8 GHz | up to 4.7 GHz | up to 4.4 GHz | up to 4.4 GHz |
| Intel® 14th (28W) | Intel® 13th/12th (28W) | |||||||
| CPU | Ultra 7‑155H | Ultra 7‑125H | i7‑1370PE | i5‑1350PE | i5‑1340PE | i3‑1320PE | i5‑1350P | i5‑1250P |
| DDR | DDR5 (Max. 96 GB) | DDR5 (Max. 64 GB) | ||||||
| Cores / Threads | 16 C / 22 T | 14 C / 18 T | 14 C / 20 T | 12 C / 16 T | 12 C / 12 T | 8 C / 12 T | 12 C / 16 T | 12 C / 16 T |
| P Turbo | up to 4.8 GHz | up to 4.3 GHz | up to 4.8 GHz | up to 4.6 GHz | up to 4.5 GHz | up to 4.5 GHz | up to 4.7 GHz | up to 4.4 GHz |





