RugCon-RV2-T3F , Compact edge AI computer , Equipped with Intel® 14th/13th/12th Core™ i9/i7/i5 low power (28W/45W) high performance processor, 5x 2.5GbE/4x PoE+, 1x RS232/422/485/4x USB/8x IDIO, 5G/4G/LTE/WIFI/BT,IO screw-lock, Ignition/Remote Control,9~48V DC INPUT
- Intel® 14th/13th/12th Core™ i9/i7/i5 (P/H Series) 28W/45W)
- 5x 2.5 GbE LAN, 4x POE+(option)
- 1x RS232/422/485
- 4x USB
- 1x Mic In/Line Out
- 4 Channel isolated DI, 4 Channel isolated DO
- 2x Displays (1x DVI-D, 1x DP)
- 2x M.2 2280 M key (SATA III SSD) , support Raid 0/1
- 1x M.2 2242/3052 B key with SIM slot, support 4G/5G
- 1x Full Size Mini-PCIe with SIM slot, support 4G/5G
- 3x M.2 Key E Type 2230 for WIFI/BT/GPS
- Optional support 2x M.2 2280 Key M ( PCIe x4 ), Support AI acceleration card/image capture card/NVME SSD, etc.
- 6~48V Wide DC In Voltage Input,
- Support 1x DC Out 12V/1A Power output,
- Ignition Power Control
ENBIK RugCon-RV2-T3F is only 21.1 cm wide, combined with a sturdy shell, low power consumption, high-performance computing power and precise I/O design under small size, which is especially suitable for machine vision and automation control. The system also has a screw lock mechanism on Gigabit Ethernet, USB and other I/O to ensure the connection under impact/vibration. RugCon RV2-T3F inference platform is an ideal choice for constructing machine vision edge AI equipment, which can be used in intelligent factories and integrated into automated optical inspection to optimize the quality control process. Intelligent automatic optical inspection applications need to apply Line Scan Camera and product defect identification AI models. In the above intelligent application, by combining the appropriate image sensor with the AI model, the RV2-T3 computing platform can perform real-time inference operations at the edge. It supports five 2.5G RJ45 LANs and 4 PoE network ports for power supply, allowing users to easily integrate multiple cameras to intercept more images or video data for accurate analysis.
ENBIK RugCon RV2-T3F is a compact and powerful artificial intelligence accelerated edge computing system equipped with Intel® 14th/13th/12th Core™ i9/i7/i5(28W/45W) high performance processor. Equipped with 5 2.5 GbE (4x PoE+ optional), 1 RS232/422/485, 4 USB, 8 isolated DIO, 5 M.2 communication expansion slots and other rich and necessary interfaces. Through the M.2 2280 PCIE x4 expansion slot, it can be used to install artificial intelligence acceleration cards or high-speed NVME SSDs. In the power input part, 6~48V wide voltage input protection is provided and can support vehicle power ignition switch and remote switch control. In addition, a set of 12V DC power output is provided, which can be used for direct assistance to the peripheral equipment at the edge.
In the AI section, ENBIK RV2-T3F supports the MXM GPU computing power module, which can flexibly integrate the MF2A MXM GPU AI computing power box independently developed by EBNIK to improve the AI edge deep learning and reasoning ability and have excellent edge AI deployment cost-effectiveness.

| IO Interface | ||
| USB |
4 |
1x USB 3.0/USB 2.0
3x USB 2.0 |
| Display |
2 |
1x DVI-D (1920 x 1200) , 1x DP(4096x 2304) |
| Audio |
1 |
1x Mic-In , 1x Line Out |
| LAN |
5 |
1x 2.5 GbE with TSN support,
Option for 4x 2.5 GbE with PoE+ |
| COM |
6 |
1x Isolated RS232/422/485, 3x RS232/422/285, 2x RS232 |
| CAN |
0 |
N/A |
| DIO |
8 |
4 Channel isolated DI, 4 Channel isolated DO |
| Storage | ||
| M.2 |
2 |
2x M.2 2280 SATA, support Raid 0/1 |
| 2.5” |
0 |
N/A |
| On Board Expansion | ||
| Mini-PCIe
M.2 Expansion |
5 |
1x Full Size Mini-PCIe with SIM supporting 4G/5G/LTE
1x M.2 2242/3052 B key with SIM supporting 5G/LTE 3x M.2 Key E Type 2230 for BT/GPS |
| M.2 2280 M key |
2 |
Optional support 2x M.2 2280 Key M ( PCIe x4 ), Support AI acceleration card/image capture card/NVME SSD, etc. |
| Mechanical | ||
| Mechanical | Dimension : 211(W) x 176(D) x 113(H) mm
Weight : 2.65 kg Mounting : Wall Mount |
|
| Mechanical | ||
| AI BOX | Support installing MF2A, this is ENBIK AI BOX which equipped with MXM GPU AI Card | |
| Environmental | ||
| Operating Temp. | -25°C ~ 60°C
-40°C ~ 85°C ( Extended) |
|
| Storage Temp. | -40°C ~ 85°C | |
| Humidity | 0%~90% , non-condensing | |
| Vibration | EN 50155:2017/ IEC 61373, Category I, Class B – Body mounted
MIL-STD-810H, Method 514.8, Category 4 |
|
| Shock | EN 50155:2017/ IEC 61373, Category I, Class B – Body mounted
MIL-STD-810H, Method 516.8, Procedure I |
|
| EMC | E-Mark, EN 50121 (EN 50155 EMC)
CE/FCC Class A, according to EN 55032 & EN 55035 |
|
| Power |
| 1x Power Button
1x 3-pin pluggable terminal block for 6~48V DC Input , 1x 4-pin pluggable terminal block forIgnition control and Remote Control 1x 2-pin pluggable terminal block for12V/1A DC output |
| Warranty |
| 3 Year Warranty |
| Intel® 13th Core™ (45W) | Intel® 12th Core™ (45W) | |||||||||
| CPU | I9-13900H | I7-13700H | I5-13600H | I7-13800HE | I5-13600HE | I9-12900H | I7-12700H | I5-12600H | I7-12800HE | I5-12600HE |
| DDR | DDR5 : up to 4800MT/s (Max. 64 GB) | |||||||||
| Cores / Threads | 14 C / 20 T | 14 C / 20 T | 12 C / 16 T | 14 C / 20 T | 12 C / 16 T | 14 C / 20 T | 14 C / 20 T | 12 C / 16 T | 14 C / 20 T | 12 C / 16 T |
| P Turbo | up to 5.4 GHz | up to 5.0 GHz | up to 4.8 GHz | up to 5.0 GHz | up to 4.8 GHz | up to 5.0 GHz | up to 4.7 GHz | up to 4.5 GHz | up to 4.6 GHz | up to 4.5 GHz |





